NG:DEV.TEAM
Marked Wolf
- Joined
- Dec 6, 2005
- Posts
- 221
If you want it to have the indented shoulders like the AES, a separate mold would have to be cast. If the current design is acceptable, you can get away with making a different pcb spacer if I shrink down the profile of the shell to be the lowest common denominator between the aes and mvs shells.
Our plan B snap cases seem to be designed to fit both MVS and AES. I assume we wouldn't need those shoulders then. Only important things are that the PCBs fit and that the shells fit into AES consoles.
We wouldn't need the back bump either. I assume such a bump only makes more troubles than it's worth anyway...
Btw. do you think you can have the normal MVS shell variant ready in April? We then would switch NEO XYX MVS to those.