MetalSlugysed said:
Thanks MKL !
Do you know what are the difference between the rectangular and the squared 68000 ?
Is one better than the other ?
Why, yes... it's quite simple... Different packaging for different applications.
The square one, a.k.a. PLCC packaging is for surface mount applications. Takes up less board space. The trade off is less heat dissapation since the package size is smaller it can't radiate off as much heat.
It's part of an evolution from old plated through hole technology for large sized DIP chips to smaller, easier to manufacture & automate surface mount technology.
The chips are usually pretty close to identical inside the package. There will be some differences in die size - in other words: The newer chips are made with newer technology and made smaller in physical size. That allows for more yield at the factory since you can fit more chips on a single large wafer.
Raymond